Thermal management materials for electronic packaging
preparation, characterization, and devices
| Quelle | Sonstige Datenquellen |
| ISBN | 978-3-527-35242-5 |
| Lieferbarkeit | lieferbar |
| Katalogisat | Basiskatalogisat |
| Verlag | Wiley-VCH |
| Erscheinungsdatum | 17.01.2024 |
Beschreibung (Langtext)
Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.
