
Mesoscale simulation of the mold filling process of Sheet Molding Compound
Autor | |
Quelle | Sonstige Datenquellen |
ISBN | 978-3-7315-1173-1 |
Lieferbarkeit | lieferbar |
Katalogisat | Basiskatalogisat |
Verlag | KIT Scientific Publishing |
Erscheinungsdatum | 12.07.2022 |
Beschreibung (Langtext)
Sheet Molding Compounds (SMC) are discontinuous fiber reinforced composites that are widely applied due to their ability to realize composite parts with long fibers at low cost. A novel Direct Bundle Simulation (DBS) method is proposed in this work to enable a direct simulation at component scale utilizing the observation that fiber bundles often remain in a bundled configuration during SMC compression molding.